JPH0120701Y2 - - Google Patents

Info

Publication number
JPH0120701Y2
JPH0120701Y2 JP1982112481U JP11248182U JPH0120701Y2 JP H0120701 Y2 JPH0120701 Y2 JP H0120701Y2 JP 1982112481 U JP1982112481 U JP 1982112481U JP 11248182 U JP11248182 U JP 11248182U JP H0120701 Y2 JPH0120701 Y2 JP H0120701Y2
Authority
JP
Japan
Prior art keywords
flat
printed wiring
wiring board
semiconductor package
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982112481U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5917870U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11248182U priority Critical patent/JPS5917870U/ja
Publication of JPS5917870U publication Critical patent/JPS5917870U/ja
Priority to US06/875,517 priority patent/US4766371A/en
Application granted granted Critical
Publication of JPH0120701Y2 publication Critical patent/JPH0120701Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11248182U 1982-07-24 1982-07-24 フラット型半導体パッケージ試験用基板 Granted JPS5917870U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11248182U JPS5917870U (ja) 1982-07-24 1982-07-24 フラット型半導体パッケージ試験用基板
US06/875,517 US4766371A (en) 1982-07-24 1986-06-19 Test board for semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11248182U JPS5917870U (ja) 1982-07-24 1982-07-24 フラット型半導体パッケージ試験用基板

Publications (2)

Publication Number Publication Date
JPS5917870U JPS5917870U (ja) 1984-02-03
JPH0120701Y2 true JPH0120701Y2 (en]) 1989-06-21

Family

ID=30260740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11248182U Granted JPS5917870U (ja) 1982-07-24 1982-07-24 フラット型半導体パッケージ試験用基板

Country Status (1)

Country Link
JP (1) JPS5917870U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0124634Y2 (en]) * 1984-09-17 1989-07-25

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57378Y2 (en]) * 1977-05-23 1982-01-06
JPS6058831B2 (ja) * 1977-11-09 1985-12-21 株式会社日立製作所 電子部品の特性検査治具
JPS55146938A (en) * 1979-05-02 1980-11-15 Chiyou Lsi Gijutsu Kenkyu Kumiai Aging device for semiconductor element
JPS58140479U (ja) * 1982-03-16 1983-09-21 日本電気ホームエレクトロニクス株式会社 半導体装置の特性測定装置

Also Published As

Publication number Publication date
JPS5917870U (ja) 1984-02-03

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